摘要 |
<p>Provided is a flexible printed wiring board which has light-emitting elements mounted thereon by means of solder, and which makes it possible to achieve high heat dissipation and good flexibility at the same time. A flexible printed wiring board (1) in which a conductive layer (12) provided with a circuit section (12a) is laminated on the upper surface side of a substrate layer (11) and also heat dissipation layers comprising a metallic material having high heat conductivity are laminated on the lower surface side of the substrate layer (11), wherein a light-emitting element section (40) is mounted in part of the circuit section (12a) by means of solder and also the plurality of heat dissipation layers (13, 23) are laminated with resin layers interposed.</p> |