STACK PACKAGE AND METHOD FOR MANUAFACTURING OF THE SAME

摘要

PURPOSE: A stack package and a method for manufacturing of the same are provided to prevent the warpage of the semiconductor chips by forming a adhesive member fixing semiconductor chips to a substrate physically. CONSTITUTION: In a stack package and a method for manufacturing of the same, at least two semiconductor chips(110) is stacked in the top side of a substrate(100). The above semiconductor chips comprises a bonding pad(115) in the one-side end respectively. An adhesive member(120) is formed between the other side of the semiconductor chips and the top side of the substrate. A connecting member(130) electrically connects semiconductor chips and the substrate and the semiconductor chips with each other. A sealing cover(140) seals hermetically the adhesive member and the top side of the substrate including the connecting member and the semiconductor chip.