OSCILLATOR

摘要

In the disclosed oscillator, a wiring pattern that conducts with a pair of electrode pads, which electrically connect a piezoelectric vibrating reed, and a plurality of connection pads, which electrically connect the aforementioned piezoelectric vibrating reed and an integrated circuit element, is formed on a sealed member. The aforementioned piezoelectric vibrating reed and the aforementioned integrated circuit element are disposed in a row in a plan view. The aforementioned wiring pattern contains: an output wiring pattern that conducts one of the aforementioned connection pads to the AC output terminal of an oscillating circuit; and a power source wiring pattern that conducts one of the aforementioned connection pads to a DC power source terminal of the aforementioned oscillation circuit. The aforementioned electrode pads and the aforementioned connection pads are formed on one primary surface of a substrate that configures the aforementioned sealed member, and the aforementioned wiring pattern is formed on at least one primary surface of the substrate that configures the aforementioned sealed member. On the aforementioned one primary surface, the aforementioned electrode pads are disposed closer to the aforementioned power source wiring pattern than the aforementioned output wiring pattern is.