METHOD AND APPARATUS FOR BUMPING FINE SOLDERS

摘要

PURPOSE: A method for bumping a fine solder and a device thereof are provided to prevent an oxide film from being formed on the surfaces of solders and bump fine solders on bump pads respectively. CONSTITUTION: A wafer(10) has a plurality of bump pads(12). The wafer is arranged in a processing chamber. A transfer machine(200) transfers a template(30) into the processing chamber. An arrangement machine(300) arranges the template with the wafer. An elevation machine(400) is connected to a first chuck plate(20) on the wafer. A heater(600) is embedded in a second chuck plate(40) which supports the bottom of the template.