| 摘要 |
<p>PURPOSE: A semiconductor package and a stacked semiconductor package with the same are provided to have a shielding member which shields an electromagnetic wave, thereby preventing electronic interference due to an electromagnetic wave. CONSTITUTION: A substrate(100) comprises an upper side(110) and a lower side(120). A semiconductor chip(200) comprises a circuit unit for storing and processing data. A mounting frame(300) is formed by a base film. The mounting frame comprises an internal mounting unit(310), an external mounting unit(320), and a shielding member(340). A mold unit(800) seals the top of the substrate which includes the semiconductor chip and the mounting frame.</p> |
