发明名称 |
JUNCTION BODY, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR JUNCTION BODY |
摘要 |
<p>A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.</p> |
申请公布号 |
EP2393630(A1) |
申请公布日期 |
2011.12.14 |
申请号 |
EP20100704979 |
申请日期 |
2010.02.02 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
YAMADA, YASUSHI;OSADA, HIROSHI;YAGI, YUJI;YOSHIDA, TADAFUMI |
分类号 |
B23K35/00;B23K35/26;H01L21/60 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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