发明名称 |
Printed circuit boards having pads for solder balls and methods for the implementation thereof |
摘要 |
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point. |
申请公布号 |
US8079011(B2) |
申请公布日期 |
2011.12.13 |
申请号 |
US20070000366 |
申请日期 |
2007.12.12 |
申请人 |
TAY CHENG SIEW;NGOH WENDY CHET MING;CHAN CHOI KENG;INTEL CORPORATION |
发明人 |
TAY CHENG SIEW;NGOH WENDY CHET MING;CHAN CHOI KENG |
分类号 |
G06F17/50;H05K1/11;H05K1/16;H05K7/06 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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