发明名称 |
Heat conduction from an embedded component |
摘要 |
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6). |
申请公布号 |
US8076586(B2) |
申请公布日期 |
2011.12.13 |
申请号 |
US20070587694 |
申请日期 |
2007.02.09 |
申请人 |
TUOMINEN RISTO;PALM PETTERI;IMBERA ELECTRONICS OY |
发明人 |
TUOMINEN RISTO;PALM PETTERI |
分类号 |
H05K1/00;H01L23/367;H01L23/538;H01L25/065;H05K1/02;H05K1/18;H05K3/46 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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