| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing that exhibits good adhesive properties to a noble metal such as Ag and Au and good reflow resistance and exhibits good flame retardancy without deteriorating moldability and flowability, and an electronic part device equipped with an element sealed with the same. <P>SOLUTION: The epoxy resin composition for sealing comprises (A) an epoxy resin and (B) a curing agent, where the epoxy resin (A) comprises (A1) an epoxy resin represented by general formula (1) and (A2) a bisphenol A type epoxy resin with the content of the epoxy resin (A2) being 10-80 mass% based on the total amount of the epoxy resin (A1) and the epoxy resin (A2). In the formula, R<SP POS="POST">1</SP>-R<SP POS="POST">5</SP>are the same or different and are each a hydrogen atom, a 1-6C alkyl group or a 1-2C alkoxy group; and n is an integer of 0-10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
