| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device with excellent heat dissipation properties. <P>SOLUTION: According to an embodiment, a light-emitting device comprises a light-emitting chip, an external terminal composed of a metallic material, and a wiring board on which the light-emitting chip is mounted via the external terminal. The light-emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulator layer, a first wiring layer, a second wiring layer, a first metal pillar, a second metal pillar, and a resin layer. The wiring board includes a wiring that is connected to the first metal pillar and the second metal pillar via the external terminal, and a heat dissipation material that is provided in contact with the wiring under the wiring. <P>COPYRIGHT: (C)2012,JPO&INPIT |
