| 摘要 |
An apparatus for testing electric characteristics of a semiconductor device having a plurality of hemispherical electrode terminals on one surface thereof, including: a support plate vertically movably supported by an elastic member, supporting a side of the one surface of the semiconductor device, and having through holes for accommodating the hemispherical electrode terminals; a probe pin securing block placed under the support plate; a plurality of probe pins secured to the probe pin securing block and having concave-shaped tips facing the hemispherical electrode terminals of the semiconductor device supported by the support plate; and a vertically movable pressing head placed over the support plate for applying a downward pressure on the support plate, wherein after the support plate is lowered by a predetermined amount by the downward pressure from the pressing head, the pressing head contacts the semiconductor device and applies a downward pressure thereon.
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