| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a MEMS structure capable of improving machining accuracy of a part where a gap part between a movable electrode and a fixed electrode is formed. <P>SOLUTION: One side surface of a semiconductor substrate 3 is joined to a support substrate 3 in such a state that at least a part of the surface of a semiconductor substrate 3 is not brought into contact with the support substrate, and at the same time, a plurality of gap parts δ1 to δ5 having different widths are formed on parts which are not brought into contact with the support substrate 2 of the semiconductor substrate 3 by means of etching and, thereby, a movable part 5 and a fixed part 6 which relatively displaces by inputting a physical quantity are formed. The movable part 5 and the fixed part 6 include a movable electrode (comb-shape movable electrode) 51 and a fixed electrode (comb-shape fixed electrode) 61 which are oppositely arranged with first gap parts δ1, δ2 and, on the one side surface (lower surface in Fig.2) of a semiconductor substrate 3, a difference surface 10 protruded more on the support substrate 2 side from the ordinary surface 30 where the first gap parts δ1, δ2 are formed is disposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
