| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that can improve radiation performance and can improve the reliability of the device at low cost, while suppressing lowering of brightness of a semiconductor light-emitting element. <P>SOLUTION: A first inner lead 10b is extended along an outer wall surface of a molding resin part 65 to penetrate the molding resin part 65. A first outer lead 10a connecting to the first inner lead 10b, and a second inner lead 20b are extended to penetrate the molding resin part 65, and a second outer lead 20a connecting to the second inner lead 20b is disposed. The area of the first outer lead 10a is larger than that of the second outer lead 20a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
