DISTRIBUTED COOLING OF ARRAYED SEMI-CONDUCTOR RADIATION EMITTING DEVICES
摘要
Techniques for the removal of waste heat from solid state, semiconductor devices (such as cooking or heating devices) are provided. In particular, techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition, a multi-head cooling system applicable to multiple solid state, semiconductor sources is provided.
申请公布号
WO2011153274(A1)
申请公布日期
2011.12.08
申请号
WO2011US38805
申请日期
2011.06.01
申请人
PRESSCO IP LLC;KATZ, JONATHAN, M.;JOHNSON, BENJAMIN, D.