发明名称 |
Semiconductor Package with Integrated Inductor |
摘要 |
A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core. |
申请公布号 |
US2011298088(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US20100795230 |
申请日期 |
2010.06.07 |
申请人 |
ELIAN KLAUS;THEUSS HORST;MEYER-BERG GEORG |
发明人 |
ELIAN KLAUS;THEUSS HORST;MEYER-BERG GEORG |
分类号 |
H01L29/86;H01L21/56 |
主分类号 |
H01L29/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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