| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire capable of preventing cracks (flaws) of a coating layer in wire drawing, and having an increased electric resistance value. <P>SOLUTION: A core material 1, made of copper of 99.99 mass% or more and P of 5-250 ppm to be added, is covered with a coating layer 2 made of Pt or Pd containing Cu of 1-50 mass%. This wire W has a high electric resistance value due to P addition and a spark can form FAB stabilized with a low current and a short time. At heat treatment, in a reaction in the interface of the core material and the coating layer 2 when Cu is included in the coating layer 2, a diffusion reaction is loosened compared to a reaction between a coating layer 2 consisting of a pure metal and the copper core material 1, so that sufficient adhesion is obtained even when the heat treatment temperature is raised. Enhancement of adhesion prevents the coating layer 2 from damage in wire drawing and also hardly causes occurence of cracks. <P>COPYRIGHT: (C)2012,JPO&INPIT |
