发明名称 WIRING CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring circuit substrate capable of uniformly performing a pre-flux processing on a first inside terminal and a second inside terminal, and stably mounting a preamplifier, and a method of manufacturing the wiring circuit substrate. <P>SOLUTION: A wiring circuit substrate 1 comprises a base insulation layer 12, and a first conductor pattern 13 and a second conductor pattern 14 formed on the base insulation layer 12. In the wiring circuit substrate 1, the first conductor pattern 13 equipped with a first wiring 21 connecting a suspension side terminal 20 provided with a metal plating layer 22 and a first preamplifier side terminal 19 soldered to the preamplifier 7, and the second conductor pattern 14 equipped with a second wiring 18 connecting a soldered substrate side terminal 17 and a second preamplifier side terminal 16 soldered to the preamplifier 7 are formed. After the metal plating layer 22 is formed on the second wiring 18, the first preamplifier side terminal 19 and the second preamplifier side terminal 16 are subjected to a pre-flux processing. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011249369(A) 申请公布日期 2011.12.08
申请号 JP20100117819 申请日期 2010.05.21
申请人 NITTO DENKO CORP 发明人 KAMEI KATSUTOSHI;SUGIMOTO YU;KITAMURA KIMIHIDE
分类号 H05K1/02;G11B21/21;G11B33/12 主分类号 H05K1/02
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