发明名称 |
LASER PROCESSING WITH ORIENTED SUB-ARRAYS |
摘要 |
In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates. |
申请公布号 |
US2011297851(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US201113153928 |
申请日期 |
2011.06.06 |
申请人 |
LAUER WILLIAM;EHRMANN JONATHAN S.;GRIFFITHS JOSEPH J.;GSI GROUP CORPORATION |
发明人 |
LAUER WILLIAM;EHRMANN JONATHAN S.;GRIFFITHS JOSEPH J. |
分类号 |
G21K5/00 |
主分类号 |
G21K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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