| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor module which exhibits good heat dissipation. <P>SOLUTION: In the method for manufacturing a semiconductor device 1, an insulation sheet 10 formed of a thermosetting resin composition is used, and in a state where the insulation sheet 10 is in uncured state, a heat spreader 30 is bonded thermally to one side thereof and a heat sink 20 is bonded thermally to the other side thereof thus thermally hardening the thermally bonded insulation sheet 10. One side and the other side of the insulation sheet 10 are formed of different thermosetting resin compositions, and the other side is formed of a thermosetting resin composition having a rate of thermal hardening reaction lower than that on the one side. The other side of the insulation sheet 10 is bonded thermally to the heat sink 20, and then the one side is bonded thermally to the heat spreader 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
