| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board in accordance with an aspect of the present invention includes: a base board having a pad formed on one surface thereof; a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity; and an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed |
| 申请公布号 |
US2016081191(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514733245 |
申请日期 |
2015.06.08 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MOK Jee-Soo;BAEK Yong-Ho;KO Young-Gwan |
| 分类号 |
H05K1/11;H05K1/18;H05K3/30;H05K3/40;H05K3/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a base board having a pad formed on one surface thereof; a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity; and an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed. |
| 地址 |
Suwon-Si KR |
