发明名称 ASSEMBLY OF ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: An electronic component assembly for flowing a bulk of a current and a forming method thereof are provided to reduce contact resistance by connecting the electrodes connected to electronic components with an area contact. CONSTITUTION: A first electronic component with a first electrode(110) is prepared. The adhesive member including a conductive connection particle(410) is arranged on the first electrode. A second electronic component with a second electrode(310) is prepared. A second electronic component is arranged to contact the second electrode with the adhesive member. An area contact part, which is contacted with at least one of the first electrode and the second electrode, is formed.
申请公布号 KR20110131972(A) 申请公布日期 2011.12.07
申请号 KR20100051725 申请日期 2010.06.01
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 PAIK, KYUNG WOOK;LEE, KI WON;KIM, SEUNG HO
分类号 H05K3/32;C08J5/18 主分类号 H05K3/32
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