A FAULTY-TEST SYSTEM OF THE LED CHIP

摘要

PURPOSE: An LED chip junction failure check system is provided to determine whether a contact point about a contact point area which is wire-bonded is faulty or not and to secure the reliability of an inspection. CONSTITUTION: LED chips are installed in an LED package array plate. A lead of the LED chip package is arranged in the LED package array plate. A probe pin unit(3) is connected to the lead and sanctions electricity. The probe pin unit is used for distinguishing a failure about junction of the LED chip, a gold wire, a silver wire, and a copper wire. A settlement plate is applied a power source and is heated. The settlement plate heats the LED package array plate. The LED package array plate is settled in the settlement plate. A probe pin of the probe pin unit passes through a guiding hole. A top plate(11) pressurizes and fixes the LED package array plate.