MULTI-LAYERED CIRCUIT BOARD ASSEMBLY,申请号KR20040056728-传众专利搜索

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发明名称	MULTI-LAYERED CIRCUIT BOARD ASSEMBLY
摘要
申请公布号	KR101090038(B1)	申请公布日期	2011.12.07
申请号	KR20040056728	申请日期	2004.07.21
申请人		发明人
分类号	H05K7/20;H05K1/18;H05K3/46	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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