| 摘要 |
PURPOSE: A semiconductor device is provided to reduce stress which is applied to through silicon via and an inner wire by equally distributing the stress which is applied to the connection wiring interlinking the through silicon via and the inner wire. CONSTITUTION: A laminated semiconductor chip is connected to through silicon via(21). An inner wire(31) interlinks the through silicon via and a memory chip. A connection wiring(32) interlinks the through silicon via and the inter space of a selected semiconductor chip. The connection wiring and the inner wire are connected by a first contact(33). A second contact(34) interlinks the other part of the memory chip and the inner wire.
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