发明名称 |
Semiconductor package having a plurality input/output members |
摘要 |
A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by a die attach material. A third semiconductor die is coupled to the second semiconductor die by a die attach material. A second substrate having a plurality of electrically conductive patterns formed thereon is coupled to the third semiconductor die. A plurality of contacts is coupled to a bottom surface of the first substrate. A connector jack is coupled to the second substrate. A plurality of leads is coupled to the second semiconductor die by conductive wires. |
申请公布号 |
US8072058(B2) |
申请公布日期 |
2011.12.06 |
申请号 |
US20040972686 |
申请日期 |
2004.10.25 |
申请人 |
KIM YONG WOO;YOO YONG SUK;AMKOR TECHNOLOGY, INC. |
发明人 |
KIM YONG WOO;YOO YONG SUK |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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