| 摘要 |
PURPOSE: An embedded type printed circuit board and a manufacturing method thereof are provided to secure generality of manufacturing and to be applied to not only an active part but also a passive device. CONSTITUTION: A first metal layer(110) comprises a circuit pattern. Electronic device chips(140,150) are mounted in the first metal layer. A metal bump which includes a fixed pattern is selectively formed on the first metal layer. A connecting pad is formed on the metal bump using a solder member. The connecting terminal of the electronic device chip and the connecting pad are connected. A non-conductive overcoat block(C) surrounds the electronic device chip. First insulation layers buries the non-conductive overcoat block. A second metal layer(190) comprises the circuit pattern. The circuit pattern is formed on the first insulation layer.
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