发明名称 MOUNTING METHOD, BOARD WITH ELECTRICAL COMPONENT, AND ELECTRICAL APPARATUS
摘要 An electric device having high reliability is to be produced. An adhesive layer 20 includes a thermosetting resin and a radiation-curable resin, and a portion of the adhesive layer 20 is protruded outwardly from an edge of the electric part 15. Radiation rays 29 do not pass through the electric part 15, and the radiation-curable resin is cured in the protruding portion 26, while the radiation-curable resin in that portion of the adhesive layer 20 which is positioned right behind the electric part 15 is not polymerized. Since the electric part 15 is fixed with the polymerized radiation-curable type resin, the electric part 15 is not misaligned when the electric part 15 is pressed under heating.
申请公布号 KR101088577(B1) 申请公布日期 2011.12.05
申请号 KR20087024412 申请日期 2007.03.06
申请人 发明人
分类号 H01L21/60;H05K3/32 主分类号 H01L21/60
代理机构 代理人
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