PROCESS FOR PRODUCTION OF PHOSPHORUS-ATOM-CONTAINING PHENOL, NOVEL PHOSPHORUS-ATOM-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR SEALING MATERIAL

摘要

Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P-H group or a P-OH group. The resultant reaction product is then allowed to react with a phenol (a3).