ORGANIC SOLDERABILITY PRESERVATIVES WITH HIGH THERMO-STABILITY AND PREPARATION METHOD THEREOF

摘要

PURPOSE: An organic solderability preservative is provided to improve the surface properties of a solder pad and interface properties, reduce the cost of a monomer, reduce the generation of a nasty smell, facilitate the storage of a complete product. CONSTITUTION: An organic solderability preservative comprises a copolymer of 4-vinyl pyridine and methylmethacrylate. The copolymer of 4-vinyl pyridine and methylmethacrylate is in the chemical formula 1. In the chemical formula 1, each n or m is 1-300. A manufacturing method of a microelectronic package substrate comprises: a step spreading the organic solderability preservative to a solder pad formed on the substrate; a step mounting a semiconductor devices on one side of the substrate; a step conducting an EMC-molding process on one side in which the semiconductor device is mounted; and a step eliminating the spread organic solderability preservative by dissolving in solvent.