| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed board that allows wiring patterns of the board to be designed in high density without restricting the location of terminals of a semiconductor device, and to provide a method of manufacturing the same. <P>SOLUTION: A multilayer printed board 2 comprises a semiconductor package 1 including a flexible wiring layer 14b with a free-end edge, and the flexible wiring 14 b is electrically connected to an inner wiring layer 24c in the printed board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
