发明名称 TRANSPARENT FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a transparent flexible printed wiring board superior in adherence of a transparent film and a transparent electroconductive film, flexibility and heat resistance. <P>SOLUTION: A method for manufacturing the transparent flexible printed wiring board includes: preparing a transparent polyimide film 1 in which a dimensional change rate accompanied by a baking step is &plusmn;0.2% or less; printing ITO particulates and ITO ink containing a binder in a predetermined pattern shape on the transparent polyimide film 1 by an inkjet method; subsequently baking the ITO ink at 230&deg;C-300&deg;C; and thereby forming a transparent electroconductive film 2 having a ratio of the binder of 5-10 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011243928(A) 申请公布日期 2011.12.01
申请号 JP20100117425 申请日期 2010.05.21
申请人 NIPPON MEKTRON LTD 发明人 OZAKI KAZUYUKI;IWASE MASAYUKI
分类号 H05K3/10;H05K1/02;H05K1/11;H05K3/12;H05K3/40 主分类号 H05K3/10
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