发明名称 |
TRANSPARENT FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transparent flexible printed wiring board superior in adherence of a transparent film and a transparent electroconductive film, flexibility and heat resistance. <P>SOLUTION: A method for manufacturing the transparent flexible printed wiring board includes: preparing a transparent polyimide film 1 in which a dimensional change rate accompanied by a baking step is ±0.2% or less; printing ITO particulates and ITO ink containing a binder in a predetermined pattern shape on the transparent polyimide film 1 by an inkjet method; subsequently baking the ITO ink at 230°C-300°C; and thereby forming a transparent electroconductive film 2 having a ratio of the binder of 5-10 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011243928(A) |
申请公布日期 |
2011.12.01 |
申请号 |
JP20100117425 |
申请日期 |
2010.05.21 |
申请人 |
NIPPON MEKTRON LTD |
发明人 |
OZAKI KAZUYUKI;IWASE MASAYUKI |
分类号 |
H05K3/10;H05K1/02;H05K1/11;H05K3/12;H05K3/40 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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