METHOD OF PACKAGING A WIRE-BONDED INTEGRATED CIRCUIT

摘要

An integrated circuit 15 is placed onto a lead frame 101 having lead fingers 109 of substantially constant thickness along their length. Wires are formed from the lead fingers 109 to corresponding electrical contacts the integrated circuit. Following the wire bonding process, the thickness of the tips of the lead fingers 109 is reduced by a laser process, to form tips of reduced thickness desirable for a subsequent moulding operation. Thus, at the time of the wire bonding the tips of the fingers 109 need not have a gap beneath them, so that more secure wire bonds to the lead fingers 109 can be formed.