| 发明名称 |
MAGNETICALLY SINTERED CONDUCTIVE VIA |
| 摘要 |
The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic components of the microelectronic packages may have sintered conductive vias comprising sintered metal and magnetic particles.
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| 申请公布号 |
US2011291276(A1) |
申请公布日期 |
2011.12.01 |
| 申请号 |
US20100787968 |
申请日期 |
2010.05.26 |
| 申请人 |
SWAMINATHAN RAJASEKARAN;MAHAJAN RAVINDRANATH V. |
发明人 |
SWAMINATHAN RAJASEKARAN;MAHAJAN RAVINDRANATH V. |
| 分类号 |
H01L29/40;H01L21/00 |
主分类号 |
H01L29/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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