| 发明名称 |
LIGHT EMITTING DIODE PACKAGE |
| 摘要 |
A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip. |
| 申请公布号 |
US2011291135(A1) |
申请公布日期 |
2011.12.01 |
| 申请号 |
US201113038385 |
申请日期 |
2011.03.02 |
| 申请人 |
HSIEH MIN-TSUN;TSENG WEN-LIANG;CHEN LUNG-HSIN;LIN CHIH-YUNG;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
HSIEH MIN-TSUN;TSENG WEN-LIANG;CHEN LUNG-HSIN;LIN CHIH-YUNG |
| 分类号 |
H01L33/58 |
主分类号 |
H01L33/58 |
| 代理机构 |
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