发明名称 COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DUTY CYCLE CONTROL
摘要 Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.
申请公布号 WO2011149790(A2) 申请公布日期 2011.12.01
申请号 WO2011US37436 申请日期 2011.05.20
申请人 APPLIED MATERIALS, INC.;MAHADESWARASWAMY, CHETAN;RAMASWAMY, KARTIK;LIAO, BRYAN;SHOJI, SERGIO;NGUYEN, DUY, D.;NOORBAKHSH, HAMID;PALAGASHVILI, DAVID 发明人 MAHADESWARASWAMY, CHETAN;RAMASWAMY, KARTIK;LIAO, BRYAN;SHOJI, SERGIO;NGUYEN, DUY, D.;NOORBAKHSH, HAMID;PALAGASHVILI, DAVID
分类号 H05H1/24;H01L21/205;H01L21/3065 主分类号 H05H1/24
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