| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of processing a wafer in which a reinforcement plate is easily peeled from a top surface of the wafer. <P>SOLUTION: The method of processing the wafer having devices in respective regions sectioned by a plurality of predetermined division lines formed on a surface in a lattice shape includes a reinforcement plate arrangement process of arranging the reinforcement plate on the top surface of the wafer via a heat-resistant bond agent; a reverse-surface grinding process of holding the reinforcement plate with a chuck table and grinding the reverse surface of the wafer with a grindstone; a through electrode formation process of forming a through electrode connected to electrodes of the devices formed on the top surface of the wafer from the reverse side of the wafer arranged on the reinforcement plate; a reinforcement plate removal process of removing the reinforcement plate from the top surface of the wafer after heating the reinforcement plate side while holding the reverse surface side of the wafer by the chuck table to soften the heat-resistant bond agent; and a heat-resistant bond agent removal process of removing the heat-resistant bond agent from the top surface of the wafer by supplying a solvent to the heat-resistant bond agent sticking on the top surface of the wafer held by the chuck table to dissolve the heat-resistant bond agent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
