| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film adhesive that can achieve reduction in heating period without degrading storage stability of the film adhesive. <P>SOLUTION: The film adhesive comprises: an epoxy resin (A); a microcapsule-type latent curing agent (B) configured such that solid powder as a curing agent of the epoxy resin is used as a nucleus, which then is covered with a film; and an organic solvent (C) that dissolves the solid powder in the microcapsule-type latent curing agent. The content rate of the organic solvent (C) is 0.001 to 0.35 wt.%. The film adhesive may comprise a conductive particle (D). <P>COPYRIGHT: (C)2012,JPO&INPIT |
