发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board which can suppress or avoid dimensional errors, shape distortion and deformation in flying leads placed to project into device holes, and a method for manufacturing the same. <P>SOLUTION: On the surface of an insulating base material 1 of the printed wiring board, there are wires 2 and a device hole 4, as well as flying leads 3 placed to connect with the wires 2 and to project into the device hole 4. The device hole 4 is composed of first device holes 5 (5a, 5b, 5c) formed to at least contain the ends of the flying leads 3, and a second device hole 6 which is larger than the first device holes 5 and formed to be continuous at least partially with the first device holes 5. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011243777(A) 申请公布日期 2011.12.01
申请号 JP20100115147 申请日期 2010.05.19
申请人 HITACHI CABLE LTD 发明人 IMAI NOBORU;ISAKA FUMIYA;OMORI TERUYUKI;HOSHI MASAHIRO;FUKUI KAZUKI
分类号 H01L21/60 主分类号 H01L21/60
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