| 摘要 |
An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck is configured to support and hold a wafer that comprises an adhesive layer on its top surface. The contact roller comprises an elongated cylindrical body extending along a first axis passing through its center and is configured to rotate around the first axis and to move linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller comprises an elongated cylindrical body extending along a second axis passing through its center and is configured to rotate around the second axis. The second axis is parallel to the first axis and the pick-up roller is arranged at a first distance from the contact roller. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller comprises a 360° degrees circular surface layer rolled around and attached to its outer cylindrical surface. The contact roller further includes means for attaching the detaping tape onto the adhesive layer by rotating clock-wise around its axis and linearly moving along a first direction over the wafer and means for contacting the adhesive layer with the 360° degrees circular surface layer. |
