| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform various treatment to a movable part formed in a movable state, in a state that breakage is suppressed. <P>SOLUTION: A device wafer 101 and a mask wafer 103 are aligned and stuck, and thereafter, selective dry treatment through openings 104 of the mask wafer 103 is performed to MEMS elements 102. For example, a film of a metal or the like is selectively formed at the movable part (not shown) of the MEMS element 102 by the dry treatment such as physical vapor deposition or chemical vapor deposition. For example, a metal film formed of gold is selectively formed at the MEMS element 102. <P>COPYRIGHT: (C)2012,JPO&INPIT |
