| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method which allows electrodes of electronic components to be joined firmly to the electrodes of a printed circuit board even when any electronic component is warped when heated, an electronic component manufacturing method and electronic components, and an electronic component manufacturing apparatus. <P>SOLUTION: An electronic component 1 includes a substrate body 2 which has arranged thereon in lattice form a plurality of electrodes 3a-3e comprising the electronic component 1. Of the plural electrodes 3a-3e, the electrodes 3a and 3e having a designated height are disposed at an outer position of the substrate body 2 which warps greater than the other position, and the electrodes 3b, 3c, and 3d, with their solder balls flattened to a lower height than that of the electrodes 3a and 3e at the outer position by a pressure applied from a pressurizing head 4, are disposed in a central position which warps less than the outer position. <P>COPYRIGHT: (C)2012,JPO&INPIT |
