发明名称 Vacuum coating the substrates, comprises impinging an evaporation source on surface part of evaporation product in vacuum by energy source directed on the surface parts of the evaporation product at a point of impingement location
摘要 <p>The method for vacuum coating the substrates (1), comprises impinging an evaporation source (4) on a surface part of an evaporation product (8) in a vacuum by an energy source (5) directed on the surface parts of the evaporation product at a point of an impingement location(12), producing emitting areas under the formation of a steam directed on the substrate, feeding the evaporation product of the evaporation source in the form of a round rod with its axis at an oblique angle to a normal of the impingement location, and rotating the rods with a rotation speed at its axis. The method for vacuum coating the substrates (1), comprises impinging an evaporation source (4) on a surface part of an evaporation product (8) in a vacuum by an energy source (5) directed on the surface parts of the evaporation product at a point of an impingement location(12), producing emitting areas under the formation of a steam directed on the substrate, feeding the evaporation product of the evaporation source in the form of a round rod with its axis at an oblique angle to a normal of the impingement location, rotating the rods with a rotation speed at its axis, reguiding the evaporation product to the evaporation source by feeding the rods in their axis direction, where an energy input takes place from the directed energy source, and coordinating the diameter of the rods and the energy input to each other, so that the material removal produces a cone-shaped rod tip at the evaporating rotating rod ends by evaporation. The area, which emits vapor, forms at the tip of the rods and stands oblique to the axis direction of the rods, is optimized towards a coating zone through the rod inclination angle, where the normal of the evaporated area indicates in a substrate direction. The rotation speed of the rods is adjusted in dependent of the evaporation rate and the feed rate. The radiation energy is captured by heat absorption unit. The radiation energy is measured and the power of the directed radiation source and/or the feed speed of the rods are regulated. The substrate is coated by several evaporation sources, so that the vapor steams of the evaporation sources superimpose and the substrate homogenously coat. The substrate is moved relative to the evaporation source during coating. The rotation speed of the rods is adjusted, so that it carries out several rotations during substrate passage. The evaporation sources are aligned in dependent of each other in its vapor propagation direction, so that the substrate to be coated is evaporated from different directions. The directed energy source is implemented as electron beam, which is joined to the impingement location over a magnet system. An independent claim is included for a device for vacuum coating the substrates.</p>
申请公布号 DE102010041150(A1) 申请公布日期 2011.12.01
申请号 DE20101041150 申请日期 2010.09.21
申请人 VON ARDENNE ANLAGENTECHNIK GMBH 发明人 REINHOLD, EKKEHART;FABER, JOERG, DR.;SEYFERT, ULF, DR.
分类号 C23C14/06;C23C14/30 主分类号 C23C14/06
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