CHIP SUBMOUNT, CHIP PACKAGE, AND FABRICATION METHOD THEREOF

摘要

A light-emitting diode submount includes a base, a through silicon via and a sealing layer. The base has a die side and a back side. The through silicon via penetrates the base to connect the die side and the back side. The through silicon via includes a conoidal-shaped portion converging from the back side toward the die side, and a vertical via portion connects with the conoidal-shaped portion. A sealing layer seals the vertical via portion.