INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE CONNECTION AND METHOD OF MANUFACTURE THEREOF

摘要

PURPOSE: An integrated circuit packaging system and a manufacturing method thereof are provided to improve reliability by mounting a second terminal on a first terminal. CONSTITUTION: A first terminal with a joint ring is formed. An integrated circuit(218) is connected to the first terminal. A second terminal(230), which is connected to the top parts of the first terminal and the integrated circuit by a vertical conductive post, is formed. The second terminal is connected to the top parts of the first terminal and the integrated circuit by the vertical conductive post which is surrounded by the joint ring. The vertical conductive post is integrally formed with the first terminal or the second terminal. The integrated circuit and the vertical conductive post are surrounded while a part of the second terminal and the first terminal is exposed.