| 摘要 |
PURPOSE: A carrier plate made of a plurality of thin metal sheets attached therebetween and a method of processing the same are provided to includes a chip insertion hole smaller than the thickness thereof while satisfying a required thickness. CONSTITUTION: In a carrier plate made of a plurality of thin metal sheets attached therebetween and a method of processing the same, a carrier plate assembly comprises a plurality of first metal thin sheets(200-1,200-2,...,200-6). The first metal sheets includes the arrays of first holes for inserting a chip. At least one second thin sheet is combined with the bottom of the carrier plate assembly. The second metal thin sheet includes the array of second holes for supporting the chip and discharging air. |
