| 摘要 |
PURPOSE: A method for separating a light emitting chip from a sapphire substrate is provided to reduce manufacturing costs by separating a light emitting chip from a sapphire substrate and reusing the sapphire substrate. CONSTITUTION: An N-type clad layer, an active layer, a P-type clad layer, and a transparent electrode unit(90) are deposited on a substrate. A substrate, in which the transparent electrode unit is deposited by an etching space unit(20), is divided into a light emitting chip. An insulating layer(80) is coated on the etching space unit. The light emitting chip is separated from the substrate by the blade part of a blade unit(5). The blade unit is made of a hard metal, zirconia, and a sapphire or their coating combination.
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