发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of managing processing condition on the basis of information on the use. <P>SOLUTION: A substrate processing apparatus 10 comprises: an operation part 14 for instructing processing of a wafer 18; a recipe file for defining processing condition for processing the wafer 18; a main control part 16 for performing substrate processing on the basis of the processing condition in accordance with the instruction from the operation part 14; a recipe file management program for updating information on the use of the recipe file; and a storage unit 210 for associating at least the recipe file with the information on the use of the recipe file to store it. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011238823(A) 申请公布日期 2011.11.24
申请号 JP20100109956 申请日期 2010.05.12
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TERANISHI ISAO
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址