| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide Pb-free Zn solder alloy for high temperature, which has a melting point of about 300°C to 400°C suitable for assembly of electronic parts and is excellent in wettability, bondability and reliability and does not contain Pb and includes Zn as a main component. <P>SOLUTION: First Pb-free Zn solder alloy is ternary solder alloy in which Bi and Sn are added to Zn being the main component, and contains Bi being the second element in an amount of 0.1 to 8.0 mass% and Sn being the third element in an amount of 0.3 to 10.0 mass%. Moreover, second Pb-free Zn solder alloy is quaternary solder alloy in which Bi, Sn and P are added to Zn being the main component, and contains Bi being the second element in an amount of 0.1 to 8.0 mass%, Sn being the third element in an amount of 0.3 to 10.0 mass, and P being the fourth element in an amount of 0.500 mass% or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
