| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a single-layer circuit board having conductive vias and a wiring layer and a method for manufacturing the single-layer circuit board, with which it becomes possible to improve a connection reliability of an electric connection part at the time of substrate lamination. <P>SOLUTION: An individual single-layer circuit board 10 includes an insulating layer 11 and a wiring layer 13 formed on a principal surface 11b of the insulating layer 11. The single-layer circuit board 10 further includes conductive vias 20 formed in via holes 14 passing through the insulating layer 11. Each conductive via 20 includes one end 20a protruding from the insulating layer 11 and the other end 20b connected to the wiring layer 13, and a groove-shaped void 30 exists between a side wall 20c of the conductive via 20 and an inner wall 14c of a corresponding via hole. The void 30 functions as a space, into which an adhesive resin flows, when the single-layer circuit board 10 is laminated through an adhesive resin layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
