| 摘要 |
<p>PURPOSE: A tape type light package and a manufacturing method of the same are provided to reduce the volume and thickness of a total package by forming a package based on a tape substrate. CONSTITUTION: In a tape type light package and a manufacturing method of the same, a hole is formed in a polyimide film(103) through punching. The hole includes a via hole through with a wire is passed to supply power to a device hole(105) and an optical device. A circuit pattern layer(104) is formed by exfoliating photoresist A gold plating is formed in a circuit pattern layer and a via hole. A solder resist layer(101) forms a barrier rip surrounding the circuit pattern layer.</p> |
